Welcome to MicroNova, a leading innovator in the semiconductor industry, dedicated to providing cutting-edge bonding equipment that powers the future of technology.
At MicroNova, we understand that the heart of every advanced electronic device lies in the precision and reliability of its semiconductor components. That’s why we specialize in designing, manufacturing, and delivering state-of-the-art bonding equipment that meets the ever-evolving demands of the semiconductor industry.
Our key advantages
Innovation Leadership
Our relentless investment in R&D ensures cutting-edge bonding technologies that keep our clients ahead in the fast-evolving semiconductor industry
Uncompromising Precision
Every machine is engineered to the highest industry standards, guaranteeing unmatched durability, accuracy, and consistency for mission-critical applications
Customer-Driven Collaboration
We deliver tailored solutions through close partnerships, addressing unique production challenges while optimizing efficiency, scalability, and long-term success
• High Accuracy: Glass die ±1.5um • Multi-Function：Supports for different process including Eutectic, Stamping, Dispensing, UV curing etc. • Multi-chips application: Supports for up to 100 different types of suction nozzles with fully automatic replacement. • High flexibility software: Supports different product applications and allows for free switching of multiple process applications.
High Accuracy: Glass die ±1.5um • High reliable Eutectic Process: Specific for COC/COS eutectic application, Validated by industry benchmark customers in China, Proved high Eutectic quality for long term mass production. • High production efficiency: unique 3-head design for Parallel operation. • Multi-chip application: Multiple suction nozzles for each bondhead with fully automatic replacement, Supports for Multi-chips process，allows for free switching of multiple process applications.
High Accuracy: Glass die ±1.5um • High reliable Eutectic Process: Specific for COC/COS eutectic application, Validated by industry benchmark customers in China, Proved high Eutectic quality for long term mass production. • High production efficiency: unique 3-head design for Parallel operation. • Multi-chip application: Multiple suction nozzles for each bondhead with fully automatic replacement, Supports for Multi-chips process，allows for free switching of multiple process applications.
• High Accuracy: Glass die ±1.5um • High Quality Epoxy Process: Specific for COB/Gold Box epoxy application, Supports for Stamping, expensing, UV curing during the bonding process. • High production efficiency: unique 3-head design for Parallel operation. • Multi-chip application: Multiple suction nozzles for each bondhead with fully automatic replacement, Supports for Multi-chips process，allows for free switching of multiple process applications.
• High intelligence visual recognition: Not rely on specific shape of the glass, supports global automatic scanning and high-precision positioning of different glass with vision marks; • High precision flatness control technology: <±5um flatness of the glass assembly； • High efficiency dispensing programming: supports for dispensing base on uploaded CAD outline drawings.
• Special equipment for nano silver film transfer printing； • High bonding force with standard pressure is 30kg, optional for 50kg or more. • Widely used in packaging fields such as High power SiC module.
• It can realize single-point dispensing, rectangle, M-shaped and other patterns of automatic glue stripping function • It can realize soft contact of the nozzle, effectively solving the active area problems such as air bridge on the surface of GaAs chip • It can make non-destructive flattening adjustments for uneven patch or large-size chips • Dispensing and patch are integrated, whole, convenient or double-head patch function to improve efficiency
• Fixed arc height, fixed line length, automatic arc starting, improve line arc consistency • Real-time monitoring of solder joint deformation, effectively guaranteeing the quality of bonding solder joints • Manual/semi-automatic function online switching, flexible and convenient, better product compatibility • Ball wireless tail/BSOB/BBOS/adding ball position/pad ball position can be set online, automatic point ball welding and wedge welding are integrated, easy and fast switching
The K780-WA automatic deep cavity wedge bonder can be configured with two material clamping methods: a fixed workbench (standard) and a track-type workbench (optional). It can be upgraded to the automatic deep cavity ball-wedge integrated bonder K780-BWA.
The K780-BA automatic deep cavity ball bonder can be configured with two material clamping methods: a fixed workbench (standard) and a track-type workbench (optional). It can be upgraded to the automatic deep cavity ball-wedge integrated bonder K780-BWA.
• Do not touch the chip surface, effectively solve the problem of clamping edge collapse • Eutectic clips are compatible with chip sizes within 8mm • Chip friction amplitude is adjustable, solder overflow is uniform, and the void rate is small • Pulse heating controller, fast heating and fast cooling
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